An analytical model to predict the depth of sub-surface damage for grinding of brittle materials

• We propose an analytical model to predict sub-surface damage during the grinding of silicon. The is based on theory dislocation kinetics and fracture mechanics. also considers strain rate effects in predicting deformation. was experimentally validated further optimize This paper proposes for grinding-induced depth a silicon wafer. integrates crack initiation mechanics propagation first time. Unlike other conventional models, proposed dynamically changing metastable phase change properties. verified by experiments comparison theoretical experimental results shows good quantitative agreement. It found that increasing speed decreasing cut cause higher so as enhance material brittleness, which favorable achieving low damage. These findings will pave way towards optimizing parameters greatly improving production efficiency hard brittle materials.